EPM1-2493 Thermally conductive material

EPM1-2493 Thermally conductive material
EPM1-2493 – Thermally conductive material that is self-leveling, 1:1 mix ratio and 1 W/mK will be promoted in June.

The profile will be revised in June to include more properties commonly asked for by customer. There is a large stock build in progress as well.

Product details…

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SIL-50X0 Class IV line of HCRs are in stock July 2012

SIL-50X0 Class IV line of HCRs are in stock July 2012Class VI Supported High Consistency Elastomer Series in stock and available in 30A-80A durometer.
SIL-5030, SIL-5040, SIL-5050, SIL-5060, SIL-5070 and SIL-5080

New listing under…
Restricted Medical Healthcare Materials
See: HCR silicone elastomers.

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Silicone fluids suitable for use in Diffusion Pumps

Engineering Materials – General Purpose – Diffusion pump fluids

PST low volatility diphenyl silicone fluids S-7400, and S-7402.

Diffusion pump fluids detail page

These have low and high temperature capability offering a low volatile content and narrow spectrum of viscosity to meet all the demanding pump applications.
Both these Silicone fluids are suitable for use in pumps, oil fluids for high vacuum, plus diffusion.
Full details…

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Press Release – 100 mol% fluorosilicone gel


Nusil Technology Debuts Low Modulus Fluorosilicone GelNuSil now offers a 100 mol% fluorosilicone gel used to fill small gaps and backfill electronics that require solvent and/or fuel resistance.

FS-3502-1 is a two-part, white, fluorosilicone gel available in an easy-to-use 1:1 mix ratio. It bonds aggressively with most surfaces, and its cure can be heat-accelerated.

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Press Release – 100M% fluorosilicone liquid


Nusil Technology Introduces 100m% Fluorosilicone Liquid Silicone Rubber NuSil is introducing its latest innovation in silicone technology:

FS-3511, a 100M% fluorosilicone liquid silicone rubber designed for molding high-quality parts that are exposed to aviation fuels such as JP-8, chemicals and solvents.

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Press Release

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Press Release – Thermally Conductive Silicone


Nusil Releases Thermally Conductive Silicone Adhesive For Electronics Industry Nusil Releases Thermally Conductive Silicone Adhesive For Electronics Industry

With low viscosity and low ionic and volatile content, EPM-2890 is ideal for applications requiring a broader operating temperature range.

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Press Release

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Polymer Systems Technology Limited

New Products Autumn 2010

Product Updates

See the new and updated equipment go to:
Dispensing Metering Transferring Mixing – Tools and Equipment

 

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Press Release – Case Study


Moisture Permeability of Silicone Systems - Case Study 2Guidelines for Choosing a Silicone
Based on Water Vapor Transmission Rates for Barrier Applications
Michelle Velderrain & Nathan Lipps

This study will assist with product selection when moisture permeability is of interest for specific applications.

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Press Release

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Press Release – Case Study


Aging Study of Silicone Materials in Simulated Gastric Fluid
Matthew Lindberg NuSil Technology
Case Study: Aging Study of Silicone Materials in Simulated Gastric Fluid

A study was performed to evaluate the properties of silicones in what is deemed to be the harshest environment of the human body: gastric acid. In this investigation, dimethyl, diphenyl, and trifluoropropyl silicones were tested and the changes in the product’s physical properties such as elongation and tensile strength were recorded and evaluated.

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Press Release – healthcare silicone elastomers


NUSIL ANNOUNCES THERMALLY CONDUCTIVE SILICONES FOR HEALTHCARE APPLICATIONS

Thermally Conductive Silicones For Healthcare Applications NuSil Technology LLC, the global leader in silicone materials for the healthcare and pharmaceutical industries, introduces two thermally conductive healthcare silicone elastomers. These elastomers can be used as a cure-in-place adhesive or potting compound between electrical/electric components and heat sinks as part of a thermal management regime to keep medical devices operating at their optimal levels.

MED-2980 and MED-2955 are able to wet out on a variety of substrates to ensure excellent contact between uneven surfaces. The low modulus characteristic of these elastomers ensures that, during operational thermal cycling, the bond line will not warp or break sensitive electronic components.

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